TMCNet:  Molex Brings Innovative, High-Performance Interconnect Technology and Expertise to Super Computing 2012

[November 14, 2012]

Molex Brings Innovative, High-Performance Interconnect Technology and Expertise to Super Computing 2012

LISLE, Ill. --(Business Wire)--

Molex Incorporated will showcase its proven expertise in high-speed, high-density and high-signal integrity interconnect technology at Super Computing 2012, November 12-15 in Salt Lake City, UT. Company leaders will conduct ongoing product demonstrations in Molex (News - Alert) booth 3745.

Products Showcased

Molex will have on display the following high-speed interconnect products and solutions:


Product Demonstration

Molex will demonstrate zQSFP+ stacked thermal management technologies. Wind tunnel testing has been found to offer the most accurate, repeatable test method. Data is generated that will support design of NEBS rated applications with current and next generation pluggable I/O modules.

To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at http://www.molex.com/link/register/.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military and lighting. Established in 1938, the company operates 40 manufacturing locations in 16 countries. The Molex website is http://www.molex.com. Follow us at http://www.twitter.com/molexconnectors watch our videos at http://www.youtube.com/molexconnectors, connect with us at http://www.facebook.com/molexconnectors and read our blog at http://www.connector.com.

Molex is a registered trademark of Molex Incorporated


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