|[November 14, 2012]
Molex Brings Innovative, High-Performance Interconnect Technology and Expertise to Super Computing 2012
LISLE, Ill. --(Business Wire)--
Incorporated will showcase its proven expertise in high-speed,
high-density and high-signal integrity interconnect technology at Super
Computing 2012, November 12-15 in Salt Lake City, UT. Company leaders
will conduct ongoing product demonstrations in Molex (News - Alert) booth 3745.
Molex will have on display the following high-speed interconnect
products and solutions:
Molex will demonstrate zQSFP+ stacked thermal management technologies.
Wind tunnel testing has been found to offer the most accurate,
repeatable test method. Data is generated that will support design of
NEBS rated applications with current and next generation pluggable I/O
To receive information on other Molex products and industry solutions,
please sign up for our e-nouncement newsletter at http://www.molex.com/link/register/.
About Molex Incorporated
Providing more than connectors, Molex delivers complete interconnect
solutions for a number of markets including data communications,
telecommunications, consumer electronics, industrial, automotive,
medical, military and lighting. Established in 1938, the company
operates 40 manufacturing locations in 16 countries. The Molex website
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and read our blog at http://www.connector.com.
Molex is a registered trademark of Molex Incorporated
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