TMCnet News
Research and Markets: Reverse Costing Report of the VGA Camera Module Supplied by Toshiba for the Nokia 2330 Mobile PhoneDUBLIN --(Business Wire)-- Research and Markets (http://www.researchandmarkets.com/research/hp4jxh/toshiba) has announced the addition of the "Toshiba Wafer-Level Camera - WLP CIS + Anteryon WL-Optic Reverse Costing" report to their offering. System Plus Consulting is proud to publish the reverse costing report of the VGA Camera Module supplied by Toshiba (News - Alert) for the Nokia 2330 mobile phone. This camera module integrates an 2.2µm pixel CMOS Image Sensor (CIS) from Toshiba. - Physical Analysis of the Camera and the CMOS Image Sensor - Step by Step Reconstruction of the Process Flow - Cost of Manufacturing and Estimation of Selling Price The CIS die is manufactured using a CMOS technology with a 0.18µm process. The module is Wafer-Level Packaged (WLP) using a TSV "via last" technology. The optical module comes from Anteryon and is manufactured with a wafer-level approach. This report provides complete teardown of the camera module with: - Detailed photos - Matrial analysis - Schematic assembly description - Manufacturing Process Flow - In-depth economical analysis - Manufacturing cost breakdown - Selling price estimation Key Topics Covered: Glossary Overview/Introduction - Executive Summary - Reverse Costing Methodology Companies Profiles - CMOS Image Sensors. Volume Shipments - Toshiba Profile - Anteryon Profile Nokia (News - Alert) 2330 Teardown Physical Analysis - Camera Module Views & Dimensions - Camera X-Ray - Camera Module Disassembly - CIS Views & Dimensions - CIS Markings - CIS Bonding - CIS Microlenses - CIS Pixels - CIS Back view - Camera Module Cross-section - Package Cross-section - Optical Module Cross-section - CIS Packaging Cross-section - CIS Cross-section Manufacturing Process Flow - CIS Process Flow - CIS Wafer-level packaging Process Flow - Description of the CIS Wafer Fabrication Unit - WL-Optic Process Flow - Description of the WL-Optic Wafer Fabrication Unit Cost Analysis - CIS FEOL + BEOL Cost - CIS Front-End Cost - CIS Back-End 0 : 1st Probe Test & Optical Test - CIS WLP Cost - CIS WLP Cost per Process Steps - CIS WLP : Equipment Cost per Family - CIS WLP : Material Cost per Family - CIS Die Cost - WL-Optic Front-End Cost - WL-Optic Cost per Process Steps - WL-Optic : Equipment Cost per Family - WL-Optic : Material Cost per Family - WL-Optic : Test, dicing and assembly - WL-Optic Price - Back-End : Final Packaging & Test - Camera Module Cost (CIS + WLO + Packaging) - Estimated Price Analysis Conclusion For more information visit http://www.researchandmarkets.com/research/hp4jxh/toshiba
|