|[December 18, 2012]
Legacy Electronics First to Receive CMTL Approval as Memory Supplier for Intel® NUC mini-pc Platforms
SIOUX FALLS, S.D. --(Business Wire)--
Design engineers and system integrators working with Intel's
Desktop Boards Next Unit of Computing (NUC) family, previewed in
June of this year, should know that Legacy
Electronics is the first memory supplier to be INTEL® Advanced
Tested through CMTL
for tis platform. Using an Intel (News - Alert)® Core™ i3 processor on a 4-by-4-inch
motherboard, the NUC is surprisingly small in size and an ideal engine
for digital signage, kiosks, home theater systems and intelligent
devices for small spaces.
Jason Engle, Legacy
Electronics' chief executive officer, said, "The Intel® NUC has two
SO-DIMM memory slots that support up to 8GB of Legacy 1600MHZ DDR3
memory each, for a total of 16GB of memory in an ultra-small package.
This new Intel® platform is key for growth in the industry and we're
delighted to be the first CMTL-approved memory supplier for the NUC."
Engle added that the NUC is mSATA-capable (mini-SATA technology designed
for portability), and Legacy Electronics offers a wide range of mSATA
solid-state drives ranging from 8GB up to 256GB to meet the most robust
John Deters, CMTL's President, commented, "Legacy Electronics continues
to maintain total commitment and technological superiority in the Intel
platform customer base by being in the first group of memory
manufacturers to be Intel Advanced Tested on the Intel NUC mini-pc
product line." Deters continued, "The Intel mini NUC platform design
represents one of the most relevant new platform form factor designs to
be introduced in the industry since the notebook computer."
About Legacy Electronics
Founded in 1993, Legacy Electronics is a U.S.-based, ISO
9001:2000-certified contract manufacturer, designer and tester of
high-speed, high-density memory modules, printed circuit boards and
other computer products. Legacy Electronics holds several patents and
trademarks, including those for its Canopy® chip-stacking process
technology, and its Multiple Device Canopy® (MDC®) for embedded
computing and high-density VLP (very low profile) modules.
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