TMCNet:  Thin-Film Integrated Passive Devices (IPDs) 2012 - Market Growing within ESD/EMI Protection, LED, RF, Digital & Mixed Signal Applications

[January 10, 2013]

Thin-Film Integrated Passive Devices (IPDs) 2012 - Market Growing within ESD/EMI Protection, LED, RF, Digital & Mixed Signal Applications

(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets (http://www.researchandmarkets.com/research/wzcdcf/thinfilm) has announced the addition of the "Thin-Film Integrated Passive Devices (IPDs) 2012" report to their offering.


Thin-film integrated passive & active devices are rapidly growing within ESD/EMI protection, LED, RF, digital & mixed signal applications A 2X GROWTH IS EXPECTED IN THE NEXT 5 YEARS WITHIN THE ELECTRONICS INDUSTRY From a commodity technology initially developed to replace bulky discrete passive components, thin-film Integrated Passive Devices (IPDs) are now a growing industry trend driven by RF, High Brightness LEDs, ESD and EMI protection, and Digital and Mixed Signal applications. This new research study on thin-film Integrated Passive and Active Devices estimates the total IPD market to grow from more than $610M this year to over $1.2B by 2017 with a CAGR of 12%.

ESD and EMI protection IPD revenues are stabilizing, primarily due to the recent decline of NOKIA in the mobile space. NOKIA has been the main driving OEM for the integration of IPDs in volume, with many handsets having from 10 to 15 ESD and EMI protection IPDs per system. It remains to be seen which OEMs will take over NOKIA's leadership in the integration of IPDs If Sony-Ericsson and Motorola have adopted the technology to limited volume, Apple recently started to adopt more and more IPD components into its end-products, while Samsung recently has been quite conservative in adopting this technology.

With a CAGR of almost 25%, the ESD and TVS protection of high power LED will be the fastest growing field of application for IPD protection components in the next five years. RF IPDs are also growing, with a CAGR of -17% expected in the next 5 years. Next generation RF (such as UWB, ZigBee, LTE, etc) is the highest growth sub-sector, as RF IPD technology offers the best value proposition in terms of matching accuracy performance, miniaturization, flexible chip to package configuration and fastest time to market solution. Digital and Mixed Signal IPD is still a very small market space. This application has the potential to take-off once IPDs reach the density and electrical performance requirements of DC-DC converter modules and high performance 2.5D silicon digital interposer substrates. Ramp-up is likely to take-off in the 2013-2015 time frame for both applications.

TOP 3 PLAYERS HOLD ALMOST 60% OF THE MARKET MANY KEY TECHNOLOGIES IN THE STARTING BLOCKS OF THIS INDUSTRY'S ROADMAP KEY FEATURES OF THE REPORT - 4 applications fields investigated (ESD/EMI protection, HB-LED ESD / TVS protection, RF and Digital & Mixed signal IPD) - Market trends and figures provided both in $M, Munits and wafer size equivalent - Technology roadmap and complete technologies and material tool-box analysis - 30 detailed company profiles of key thin-film IPD players (320 slides PPT) This new study exhaustively lists the existing and upcoming technologies and applications for IPDs. The report describes the thin-film IPD market, growth opportunities and the associated technologies deep inside each application.

Each market sub-segment is exhaustively detailed with: - Drivers and benefits of IPDs - Sub-segment size and expected growth rate - Value chain analysis - Global market evaluation per application: volume in units, wafers, and market size ($).

- Evaluation of the major market players (market share) - Key thin-film IPD product detailed teardown analysis Key Topics Covered: 1. Objectives of the Study 2. Introduction, Definitions & Scope of the Report 3. Thin-Film IPD Applications and Market Drivers 4. Thin-Film IPD Market Status & 2011-2017 Forecasts 5. Thin-Film IPD Supply Chain & Players 6. Thin -Film IPD Technologies 7. Thin-Film IPD Architecture, Assembly & Packaging 8. Conclusions & Perspectives Companies Mentioned: Click the link below to view the full list of 87 companies that feature in this extensive report.

For more information visit http://www.researchandmarkets.com/research/wzcdcf/thinfilm CONTACT: Research and Markets, Laura Wood, Senior Manager.

press@researchandmarkets.com Fax from USA: 646-607-1907 Fax from rest of the world: +353-1-481-1716 Sector: Semiconductor (http://www.researchandmarkets.com/categories.asp cat_id=102&campaign_id=wzcdcf) ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at http://www.presswire.net on the world wide web. Inquiries to info@m2.com)).

(c) 2013 M2 COMMUNICATIONS

[ Back To Cloud Computing 's Homepage ]