[January 17, 2013] |
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Molex Brings Wide-Range of Advanced Interconnect Solutions and Expertise to DesignCon
LISLE, Ill. --(Business Wire)--
Molex
Incorporated continues to meet the needs of today's design engineers
by developing products that provide not only the highest signal speeds
and integrity on the market, but also offer flexibility and scalability
for next-generation system architectures. Molex will showcase its
expertise in various forums at DesignCon 2013, January 28 - 31, 2013,
Santa Clara, CA (News - Alert), including several technical paper presentations and
ongoing solution demonstrations and product displays in booth 109.
Technical Paper Presentations
Each of these three 40-minute sessions highlights specific Molex (News - Alert)
technical and application expertise:
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Tuesday, January 29, 2013, 9:20 a.m. - 10:00 a.m. Ballroom H: Molex
experts Gregory Fitzgerald, senior signal integrity engineer; Munawar
Ahmad, principal engineer; Mark Bugg, project engineer and Michael
Rost, project electrical engineer will discuss skew in twinax cables
and its significance in next-generation differential signalling. Both
insertion loss deviation and mode conversion will also be reviewed.
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Wednesday, January 30, 2013, 2:00 p.m. - 2:40 p.m. Ballroom E: Rick
Brandwein, electrical project engineer, Molex; Glenn Oliver, senior
engineer, DuPont; Matt Doyle, signal integrity engineer, IBM (News - Alert); and John
Dangler, development engineer, IBM will demonstrate how a focus on
advanced flex circuit materials will enable flex circuits to remain
valid interconnects. Modeled and measured data will characterize
construct performance and "lessons learned" will be presented.
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Thursday, January 31, 2013, 10:40 a.m. - 11:20 a.m. Ballroom G:
Peerouz Amleshi, director; Xin Wu, senior engineer and Raghav Nallan
Chakaavarthi, electrical engineer with Molex will join Bhavesh Patel,
principal engineer, Dell (News - Alert) and Casey Morrison, application engineer,
Texas Instruments to identify the critical system signal integrity and
radiated EMI impact factors of the conventional implementation of AC
coupling capacitors in a 25Gbps+ system through 3D modeling, channel
simulation and measurement.
Product Demonstrations
The demonstrations will take place in Molex booth 109 and highlight the
company's commitment to developing next-generation solutions for its
customers:
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NeoScale™ 28 Gbps Speeds: Adam Stanczak, product development
manager, and Vivek Shah, senior electrical engineer, will conduct a
live demonstration of the latest derivatives and extensions of the
NeoScale connector, a high-speed mezzanine solution that delivers
pristine signal integrity at 28 Gbps+ data rates. The demonstration
will feature an integrated test board, a Molex connector, a Texas
Instruments chip, LeCroy test equipment and cutting edge product
extensions of the NeoScale design. For more information, please visit www.molex.com/link/neoscale.html.
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zQSFP+: Joe Dambach, global new product development manager,
will demonstrate zQSFP+ stacked thermal management technologies. Wind
tunnel testing has been found to offer the most accurate, repeatable
test method. Data is generated that will support design of NEBS rated
applications with current and next generation pluggable I/O modules.
For more information, please visit www.molex.com/link/zqsfp+.html.
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Impel™ Backplane Connector System: Pete Soupir, global new
product development manager, will be demonstrating the new Impel
backplane technology operating at 25 Gbps oer 3 different channel
lengths using the Impel reference backplane. The output will
illustrate the Impel connector performance in-channel using Megtron 6
and HVLP board material with respective transmit and receive
daughtercards. For more information, www.molex.com/link/backplane.htm.
Products Displayed
Molex will display a range of advanced interconnect products, including:
Power:
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EXTreme
EnergetiC™ High-Current Connector System: Delivers high-end
datacom OEMs and power supply manufacturers with an advanced solution
for applications requiring high current up to 100.0A per bay
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EXTreme
Guardian™ System: Winner of the 2012 DesignVision Award, the
solution features a three circuit, wire-to-board configuration that
delivers up to 80.0A of current per circuit, a PCB header with a pitch
of 11.00 mm (0.433") for increased PCB real estate savings and an
EMI-shielding option to reduce cable crosstalk and improve immunity to
external noise
I/O
Mezzanine
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NeoScale™
High-Speed Mezzanine System: Offers 2, 4, 6 and 8 row versions
with a column range of 4 to 30 columns and stack heights of 12.00 to
42.00mm to support a wide range of mezzanine applications
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SpeedStack™
Connector System: Provides PCB real-estate space savings while
optimizing airflow with a low-profile stack height of 4.00mm,
achieving up to 40 Gbps per differential pair
Backplane
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Impel™
Backplane Connector System: This scalable backplane product
provides OEMs with an upgrade model, so that they can purchase a
reduced cost daughtercard that is a viable solution for 16 Gbps, and
can upgrade to a plug-compatible daughtercard solution for 25 Gbps or
beyond.
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Impact™
XTR Daughter Cards: A daughtercard enhancement of the Impact
product family, XTR provides an upgrade path for increased signal
integrity margin necessary for evolving high-speed development,
supporting 25 Gbps+.
To receive information on other Molex products and industry solutions,
please sign up for our e-nouncement newsletter at www.molex.com/link/register/.
About Molex Incorporated
Providing more than connectors, Molex delivers complete interconnect
solutions for a number of markets including data communications,
telecommunications, consumer electronics, industrial, automotive,
medical, military and lighting. Established in 1938, the company
operates 40 manufacturing locations in 16 countries. The Molex website
is http://www.molex.com.
Follow us at http://www.twitter.com/molexconnectors
watch our videos at http://www.youtube.com/molexconnectors,
connect with us at http://www.facebook.com/molexconnectors
and read our blog at http://www.connector.com.
Molex is a registered trademark of Molex Incorporated
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