Molex to Showcase at DesignCon
Jan 24, 2013 (Close-Up Media via COMTEX) --
Molex will showcase in various forums at DesignCon 2013, Jan. 28 - 31, Santa Clara, Calif.
In a release, the Company noted that this includes technical paper presentations and ongoing solution demonstrations and product displays.
-Tuesday, Jan. 29, 9:20 a.m. - 10 a.m. Ballroom H: Molex representatives Gregory Fitzgerald, senior signal integrity engineer; Munawar Ahmad, principal engineer; Mark Bugg, project engineer and Michael Rost, project electrical engineer will discuss skew in twinax cables and its significance in next-generation differential signalling. Both insertion loss deviation and mode conversion will also be reviewed.
-Wednesday, Jan. 30, 2 p.m. - 2:40 p.m. Ballroom E: Rick Brandwein, electrical project engineer, Molex; Glenn Oliver, senior engineer, DuPont; Matt Doyle, signal integrity engineer, IBM; and John Dangler, development engineer, IBM will demonstrate how a focus on flex circuit materials will enable flex circuits to remain valid interconnects. Modeled and measured data will characterize construct performance and "lessons learned" will be presented.
-Thursday, Jan. 31, 10:40 a.m. - 11:20 a.m. Ballroom G: Peerouz Amleshi, director; Xin Wu, senior engineer and Raghav Nallan Chakaavarthi, electrical engineer with Molex will join Bhavesh Patel, principal engineer, Dell and Casey Morrison, application engineer, Texas Instruments to identify the critical system signal integrity and radiated EMI impact factors of the conventional implementation of AC coupling capacitors in a 25Gbps+ system through 3D modeling, channel simulation and measurement.
Adam Stanczak, product development manager, and Vivek Shah, senior electrical engineer, will conduct a live demonstration of the latest derivatives and extensions of the NeoScale connector, a high-speed mezzanine solution that delivers pristine signal integrity at 28 Gbps+ data rates. The demonstration will feature an integrated test board, a Molex connector, a Texas Instruments chip, LeCroy test equipment and product extensions of the NeoScale design.
Joe Dambach, global new product development manager, will demonstrate zQSFP+ stacked thermal management technologies. Wind tunnel testing has been found to offer the most accurate, repeatable test method. Data is generated that will support design of NEBS rated applications with current and next generation pluggable I/O modules.
Pete Soupir, global new product development manager, will be demonstrating the new Impel backplane technology operating at 25 Gbps over 3 different channel lengths using the Impel reference backplane. The output will illustrate the Impel connector performance in-channel using Megtron 6 and HVLP board material with respective transmit and receive daughtercards.
Molex will display:
-EXTreme EnergetiC High-Current Connector System: Delivers datacom OEMs and power supply manufacturers with a solution for applications requiring high current up to 100.0A per bay
-EXTreme Guardian System: Winner of the 2012 DesignVision Award, the solution features a three circuit, wire-to-board configuration that delivers up to 80.0A of current per circuit, a PCB header with a pitch of 11.00 mm (0.433") for increased PCB real estate savings and an EMI-shielding option
-zQSFP+ Stacked with Thermal Management Component: Continues to support 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate applications, the zQSFP+ TMC offers improved thermal performance by cooling both the upper and lower ports in order to conform to NEBS or other applications that required higher ambient temperatures of up to +55C
-zQSFP+ iPass+ zHD Vertical Connector System: Provides a 0.75mm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidth
-NeoScale High-Speed Mezzanine System: Offers 2, 4, 6 and 8 row versions with a column range of 4 to 30 columns and stack heights of 12.00 to 42.00mm to support a range of mezzanine applications
-SpeedStack Connector System: Provides PCB real-estate space savings while optimizing airflow with a low-profile stack height of 4.00mm, achieving up to 40 Gbps per differential pair
-Impel Backplane Connector System: This scalable backplane product provides OEMs with an upgrade model, so that they can purchase a reduced cost daughtercard that is a viable solution for 16 Gbps, and can upgrade to a plug-compatible daughtercard solution for 25 Gbps or beyond.
-Impact XTR Daughter Cards: A daughtercard enhancement of the Impact product family, XTR provides an upgrade path for increased signal integrity margin necessary for evolving high-speed development, supporting 25 Gbps+.
Molex is a provider of interconnect solutions.
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