TMCNet:  LED Packaging 2013 Report: Packaging Cost Reduction is Driving New Technology and Design Adoption

[February 07, 2013]

LED Packaging 2013 Report: Packaging Cost Reduction is Driving New Technology and Design Adoption

(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets ( has announced the addition of the "LED Packaging 2013" report to their offering.

Packaging cost reduction is driving new technology and design adoption, and fueling a booming equipment and material market.

EMERGENCE OF NEW DESIGN AND TECHNOLOGIES Depending on the device type, packaging can represent 40% to 60% of LED total cost. As such, packaging represents the single-largest opportunity for cost reduction, which is required in order for the industry to access the Holy Grail that is General Lighting. However, if you're expecting this cost reduction to come from standardization, you can abandon all hope. The creativity of LED engineers and specificities of each application have led to an infinite number of package type and formats: Single or multiple chips, low and middle-power Plastic Leaded Chip Carrier (PLCC), ceramic-based high-power LED, small and large arrays, Chip On Board (COB), etc. This profusion of styles is inhibiting LED manufacturing cost reduction by multiplying the Stock keeping Unit (SkU), thus preventing standardization of the manufacturing process and the associated economies of scale.

In this context, LED manufacturers are reacting by developing new manufacturing philosophies/concepts, such as: - Design for manufacturing, which consists of trying to simplify and standardize elements whenever possible, and push differentiation as far downstream as possible in the manufacturing process.

- Design for cost, which consists of favoring cost of ownership or cost per lumen over end performance.

Technological developments are also impacted by the quest for cost reduction, and LED manufacturers are now searching for equipment and/or materials with the right mix between cost and per formance. As a matter of fact, equipment and materials suppliers are proposing more and more equipment and materials that fit these requirements, i.e. laser-based dicer, low-cost ceramic package substrate, etc.

In the end, LEDs are going mainstream but are still not a mature commodity! This is good news for the entire industry, since design and materials innovation still provides opportunity for differentiation. All of this benefits the consumer, who receives budget-friendly, environmentally friendly and increasingly credible LED-based alternatives for replacing traditional light sources.

This report represents a comprehensive overview of all technological aspects of LED packaging. It describes each step of the packaging process flow, discusses the associated technological breakthroughs, provides a summary of key players, and much more! OBJECTIVES OF THE REPORT The objectives of the report are the following: - To better understand process flow and technological trends in LED packaging - To better understand the importance of cost reduction in LED packaging - To better understand who is doing what - To provide market metrics both at LED and material/equipment levels WHAT'S NEW COMPARED TO LAST EDITION - Update of all market metrics (packaged LED, equipment, materials) - Highlight of 2012 LED packaging trends (design, new technologies and materials per process step ) - Additional analysis (wafer bonding, thermal management at the LED module level) KEY FEATURES OF THE REPORT - Detailed technical analysis of each LED packaging process step - LED market metrics (units and value): Forecast 2011 - 2017 - Packaging equipment market metrics (units and value): Forecast 2011 - 2017 - Packaging material market metrics (units and value): Forecast 2011 -2017 - Technology road-map for adoption of new technologies - Supply chain analysis for each LED packaging process step Key Topics Covered: 1 Executive Summary 2 LED Market Overview 3 LED Packaging Overview 4 Wafer Bonding 5 Wafer Bonding 6 Die Singulation 7 Thermal Management - Packaging Substrates (Including COB) 8 Thermal Management - Module Substrates (Including COH) 9 ESD Protection 10 Die Attach / Die Bonding 11 Interconnects 12 Encapsulation and Optics 13 Phosphors 14 Wafer Level Packaging 15 Testing and Binning General Conclusion Companies Mentioned: Click the link below to view the list of 160 companies featured in this extensive report.

For more information visit CONTACT: Research and Markets, Laura Wood, Senior Manager. Fax from USA: 646-607-1907 Fax from rest of the world: +353-1-481-1716 Sector: Semiconductor ( cat_id=102&campaign_id=rcxjmr) ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at on the world wide web. Inquiries to


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