TMCNet:  Ceva to Demonstrate at Mobile World Congress 2013

[February 18, 2013]

Ceva to Demonstrate at Mobile World Congress 2013

Feb 18, 2013 (Close-Up Media via COMTEX) -- Ceva, Inc., a licensor of silicon intellectual property platform solutions and DSP cores, announced that it will demonstrate at Mobile World Congress 2013, in Barcelona, Spain from Feb. 25 to 28.


In a release, the Company noted that technologies on display at Ceva's stand will include: -Image Enhancement and Computer Vision -Audio, Voice and Speech -Communications and Connectivity In addition, Ceva customers, partners and OEMs will display Ceva-powered products and devices at the show, including Acer, Broadcom, Coolpad, Haier, HTC, Huawei, Intel, InterDigital, Konka, Lenovo, LG, Mindspeed, Motorola, Nokia, Samsung, SIMCom, ST-Ericsson, Telit, u-Blox, and ZTE.

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