Ceva to Demonstrate at Mobile World Congress 2013
Feb 18, 2013 (Close-Up Media via COMTEX) --
Ceva, Inc., a licensor of silicon intellectual property platform solutions and DSP cores, announced that it will demonstrate at Mobile World Congress 2013, in Barcelona, Spain from Feb. 25 to 28.
In a release, the Company noted that technologies on display at Ceva's stand will include:
-Image Enhancement and Computer Vision
-Audio, Voice and Speech
-Communications and Connectivity
In addition, Ceva customers, partners and OEMs will display Ceva-powered products and devices at the show, including Acer, Broadcom, Coolpad, Haier, HTC, Huawei, Intel, InterDigital, Konka, Lenovo, LG, Mindspeed, Motorola, Nokia, Samsung, SIMCom, ST-Ericsson, Telit, u-Blox, and ZTE.
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