|[March 18, 2014]
Unisem Selects J750-LitePoint for Testing Wireless Connectivity SOC Devices
NORTH READING, Mass. --(Business Wire)--
Inc. (NYSE: TER) announced that Unisem has selected and ordered the
J750-LitePoint product for testing wireless connectivity semiconductor
devices. Teradyne (News - Alert) installed the system at Unisem's test facility in
Chengdu, China in March 2014.
Teradyne has shipped more than 4,000 J750
family systems, delivering leading cost-of-test economics for over
150 fabless and IDM semiconductor companies in low-cost consumer SOC
markets. Now, with the addition of LitePoint®
instruments available as an upgrade to existing J750 systems, Teradyne
enables RF test capability with performance that is well aligned with
the low-cost wireless connectivity and cellular SOC market. The platform
leverages LitePoint's IQxel-M™
connectivity and cellular test products, combined with LitePoint's
modulation and analysis software, to offer J750 customers with a common
platform for SOC production test and final product verification.
"We selected the J750-LitePoint to cover the growing demand for testing
wireless connectivity devices," said Tan Kim Heng, senior VP (Technology
& Materials) of Unisem. "Incorporating LitePoint test instrumentation
onto our existing fleet of J750 systems provides Fabless and IDM
semiconductor companies with a cost-effective alternative for testing
wireless stand-alone and microcontroller products. We have already
aligned our first J750-LitePoint platform to test smart grid devices,
and are now well positioned to serve the expanding production test needs
of the mobile connectivity market."
"Teradyne is pleased to partner with Unisem to offer the J750-LitePoint
wireless test product offering," said Jason Zee, general manager of
Teradyne's Consumer Business Unit. "We're confident that the
J750-LitePoint system will enable Unisem to serve the technical and
economic requirements of its mobile connectivity customers."
For more information on the J750, visit http://www.teradyne.com/J750.
Unisem is a global provider of semiconductor assembly and test services
for many of the world's most successful electronics companies. Unisem
offers an integrated suite of packaging and test services such as wafer
bumping, wafer probing, wafer grinding, a wide range of leadframe and
substrate IC packaging, wafer level CSP (News - Alert) and RF, analog, digital and
mixed-signal test services. Our turnkey services include design,
assembly, test, failure analysis, and electrical and thermal
characterization. With approximately 6900 employees worldwide, Unisem
has factory locations in Ipoh, Malaysia; Chengdu, People's Republic of
China; Batam, Indonesia and Sunnyvale, USA. The company is headquartered
in Kuala Lumpur, Malaysia. For more information about the company, its
products and services, please visit its website at www.unisemgroup.com.
(NYSE:TER) is a leading supplier of Automatic Test Equipment used to
test semiconductors, wireless products, data storage and complex
electronic systems which serve consumer, communications, industrial and
government customers. In 2013, Teradyne had sales of $1.43 billion and
currently employs approximately 3,800 people worldwide. For more
information, visit www.teradyne.com.
Teradyne(R) is a registered trademark of Teradyne, Inc. in the U.S. and
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